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Google AMD is helping TSMC test 3D stack packaging technology

According to reports, Google and AMD are helping TSMC test and verify 3D stack packaging technology This technology is expected to start mass production in 2022, and Google and AMD will become the first customers of TSMC s chip packaging technology

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Three pillars in the global packaging and testing market

At this stage, the global semiconductor packaging and testing market presents a three-pronged situation, with semiconductor packaging and testing companies from Taiwan, China, and the United States occupying most of the market share

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​China's semiconductor development requires six strategic determination

On November 5th, at the third "Global CEO Summit " held by ASPENCORE, Wei Shaojun stated that the average annual compound growth rate of China s semiconductor industry during the 10-year period from 2008 to 2019 was 18 37%;

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SK Hynix Memory’s Q3 operating profit fell 33% month-on-month

On November 4, SK Hynix released its financial report for the third quarter of fiscal year 2020 In the third quarter, the company’s consolidated revenue was 8 129 trillion won, operating profit was 1 3 trillion won, and net profit was 1 078 trillion wo

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​Semiconductor "involution"

After recent years of industrial integration, many names such as Freescale, Fairchild, Maxim, and Altera have become history The industry structure is constantly being reshaped, but the industry trend has not changed

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​ST fleshes out Stellar automotive MCU features

STMicroelectronics has announced more details on how its new Stellar automotive MCUs ensure reliable and deterministic execution of multiple independent real-time applications

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Connected healthcare market predicted for 26% CAGR growth

Connected healthcare products will see dramatic growth to nearly $100bn by 2030 says a new report from the United Nations and P&S Intelligence

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TSMC's 5nm monolithic wafer cost exposure, nearly doubled compared to 7nm

At present, Apple’s A14 processor is the only processor on the market that has been published on the 5nm process It is built by TSMC’s 5nm process, with a staggering 11 8 billion transistors inserted into the chip, providing powerful operations

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