CASE STUDIES
Samsung's plans to ship 10nm SoCs in full sail
The 10LPE process uses triple-patterning lithography to deliver up to a 30% area shrink, 27% higher performance or 40% lower power than 14nm process
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Why foundries need clear, public benchmarks
Over the last few years, the industry has embraced the idea of measuring a process node by PPA—performance, power and area
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TSMC advances push into 3nm, machine learning
The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC
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Samsung Says EUV on Schedule for 2018
Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings
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NOR Flash Standard Meets Instant-On Expectations
IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash
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FinFETs compete with FD-SOI
Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers
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EUV rolls into TSMC's 7+nm node in 2018
TSMC has used an unnamed novel resist chemical to replace five immersion masks with one EUV mask at pitches ran
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Limitations of 3D NAND Scaling
The life span of 3D NAND might be a lot shorter than most people think At the Flash Memory Summit this year,
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