CASE STUDIES
TSMC advances push into 3nm, machine learning
The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC
Show Detail >>Samsung Says EUV on Schedule for 2018
Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings
Show Detail >>NOR Flash Standard Meets Instant-On Expectations
IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash
Show Detail >>FinFETs compete with FD-SOI
Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers
Show Detail >>EUV rolls into TSMC's 7+nm node in 2018
TSMC has used an unnamed novel resist chemical to replace five immersion masks with one EUV mask at pitches ran
Show Detail >>Limitations of 3D NAND Scaling
The life span of 3D NAND might be a lot shorter than most people think At the Flash Memory Summit this year,
Show Detail >>DRAM-less SSD controller delivers up to 1600MB/s read speeds
The 88NV1160 can be used in a single ball grid array package SSD, as well as in a standalone controller in a
Show Detail >>Controller supports SD 6.0 spec
Silicon Motion Technology has introduced what it claims is the first merchant SD memory controller to support SD
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