Embedded storage master chip

In terms of implementation technology, both embedded storage and Solid-state drive master chips rely on efficient SoC architecture to complete internal data transmission and management. The two types of chips still have differences in front-end protocols, and other technical requirements converge. For example, in terms of front-end module, embedded storage follows eMMC or UFS interface protocol to communicate with the host, and Solid-state drive master chip uses SATA or PCIE interface for host command interaction. The two can currently share technologies such as flash memory interface dedicated processors and signal processing algorithms.
 

However, unlike the master chip of Solid-state drive, the embedded storage master chip has the characteristics of low power consumption and small size based on its unique business and application scenarios, but its requirements for data writing are relatively low.
 

As a replacement product of eMMC, UFS has higher storage performance and transmission rate, and has become the mainstream choice for high-end smartphones, gradually penetrating into mid to low end products and automotive fields. At the same time, with the development of technology, embedded storage is transitioning from UFS2.1 to UFS3.1. While meeting the requirements of low power consumption and small size, the performance requirements are becoming increasingly high. In addition, with the continuous development of storage requirements, the capacity of embedded storage has also grown from 32GB/64GB to the current 256GB/512GB/1TB, and its capacity is expected to be further expanded in the future.