Operation of semiconductor sealing and testing plants in the first half of 2022

According to the statistical data, the market revenue of the top ten global semiconductor packaging manufacturers in the first half of 2022 will increase to about 17.5 billion US dollars, with a year-on-year increase of about 16.7%. In the first half of 2022, the top 10 semiconductor sealing test (OSAT) enterprises in the world ranked the same as those in the first half of 2021. Among them, there are 5 enterprises in Taiwan, 3 in mainland China, 1 in the United States and 1 in Singapore.
 

The specific operations of the world's top ten OSATs in the first half of 2022 are as follows:

No.1: ASE's operating revenue grew by 27.1% year on year, ranking first. The growth of HPC, automobile, 5G, IoT and the expanding silicon content led to strong terminal demand. In the first half of 2022, the auto electronics revenue of the sealed test business grew by 54% compared with last year.
 

No. 2: (Amkor's operating revenue grew 13.5% year on year, ranking the second. Due to the increase in demand for data centers and high-performance computing, the revenue of this part of products increased by 27% year on year; at the same time, the revenue in automotive and industrial areas increased by 16% year on year. Due to the stickiness of customer groups and the binding of long-term cooperation agreements, the capacity utilization of WB and Lead Frame is still quite stable at present.
 

No.3: JECT's operating revenue grew by about 8.5% year on year, ranking third. Changdian Technology has industry-leading advanced semiconductor sealing and testing technology in important fields such as 5G communication, high-performance computing, consumer, automobile and industry. The company will further promote the production application of high-density integrated SiP integration technology, 2.5D/3D wafer level microchip integration technology and the introduction of customer products.
 

No.4: Powertech's operating revenue grew by 8.9% year on year, ranking fourth. Licheng Technology's revenue in the first half of the year was the highest in history. Under the demand of data center, vehicle electronics and high-order computing, DRAM capacity demand is stable. NAND&SSD will also be affected due to the decline of sales volume and inventory adjustment in the consumer electronics market, but the demand for data centers will remain. The company will continue to maintain the development of Flip Chip and advanced sealed test technology in logic chip business.
 

No. 5: TFME's operating revenue grew by about 33.4% year on year, ranking fifth. The substantial growth of Tongfu's micro electric sealing and testing revenue is due to the synchronous breakthrough of all major bases. Chongchuan Factory, Nantong Tongfu, Hefei Tongfu and Tongfu Chaowei have all completed the introduction of many new products, mass production and breakthrough of key customers. It is also expected that the customer's 5nm products will be produced in small scale in the second half of the year.
 

No. 6: HT Tech's operating revenue grew by 6.9% year on year, ranking sixth. Huatian Technology now has a chiplet packaging technology platform, has completed the process development of large-scale eSiFO products, and has passed the chip level and board level reliability certification.
 

In addition, UTAC, KYEC, ChipMOS and Chipbond ranked seventh to tenth respectively.
 

In the future, with the continuous increase of 5G communication technology, the Internet of Things, big data, artificial intelligence, visual recognition, automatic driving and other application scenarios, the industry's demand for chips with lighter and thinner size, faster data transmission speed, and smaller power loss will continue to increase. As an important means to continue Moore's Law, advanced packaging has become the main increment of the future global seal test market, and the market scale will continue to grow.