The giant rob into 3 d NAND memory prices

However, 3 dnand is speeding up production, production capacity in the second half of this year if would be able to prescribe, will become a biggest NANDFlash market variables.

2 dnandflash process continues to proceed to a miniature 1 y/z 1 nm, such as samsung and hynix SK corp last year has turned into 14 nm, western digital (WD) and Toshiba into 15 nm, meguiar's import 16 nm, etc.But because the chip line width, line spacing has physical limits, 2 dnand encountered bottleneck technology development, with 1 y/z nano 2 dnand cannot produce cost-effective, so NANDFlash factory started to focus on 3 dnand investment, but also because of capacity problems, NANDFlash output decreased significantly, in the second half of the price soared.

2016 NANDFlash price from the second quarter rose across the board, rally continued to the end of the mainstream SSD prices rose more than 40%, eMMC price rise highest approximation into 6, completely came as a surprise to the markets.In such cases, the original factory in order to maintain competitive advantage, and decided to accelerate into 3 dnand market, and this year will also be a 3 year dnand market fast growth, capacity arms race is running high.

By the original factory technical process, samsung last year schedule has been successfully production 3 fastest dnand, shipments proportion reached 35% by the end of 2016, the most advanced 64 layer chip will be in the first three months of this year's capacity for tablets, 3 dnand delivery ratio will reach 45% in the first quarter.In addition, samsung has not only comprehensive production 3 dnand in xi 'an factory, South Korea 3 dnand Fab17/18 will also be put into production.

Including Toshiba and WD, SK hynix, meguiar's and other operators, last year it was three dnand process transformation rather than a year, benign and directness to the end of last year to see steady recovery, the proportion of production are less than 1.However, the beginning of the year 3 dnand production situation has improved markedly, Toshiba and WD has started to run 64 layerMemory chips, main production will begin to transfer this year to 64 layer 3 dnand, besides Fab5 begin to increase investment, Fab2 will go into production in this season of 64 layer 3 dnand Fab6 new factory will be its and forecast in the second half of 2018.

SK hynix last year at 36 and 48 layer 3 dnand production has began in earnest, 3 dnand M12 factory has production, decided to ascension to 72 this year, will be in season 1, directly or indirectly from season 2 into small piece, while South Korea M14 factory will also be in full access to 3 dnand production stage this year.

Meguiar's collaboration with Intel IMFlash has 3 dnand production last year, 64 at the end of the second generation of layer 3 dnand has landed smoothly, this year will gradually enter the volume production, 3 dnand F10x factory will start to comprehensive cast slice.Intel China dalian factory has 3 dnand, mass production and will start mass production this year a new generation of XPoint memory.