TSMC will launch a new technology of 12 nm
TSMC said recently, is currently on previous 16 nm technology improvement, the improved version will probably use 12 nm technology process, this also with continuous process improvement strategy for each generation.
12 nm process relative to today's 16 nm, not only have higher transistor integration, and further optimized in terms of performance and power consumption, have bigger rise.Memory chipsProcess often determines the power consumption, performance, and other factors, such as fever, but now the most advanced technology to achieve production level has reached the level of 10 nm, previously released Xiao dragon 835, adopted the samsung 10 nm process technology, and this year the upcoming release of the new iPhone will use 10 nm TSMC process.
Now there are a lot of information now show that TSMC and samsung, are encountered in 10 nm process technology yield problem, which is also directly contributing to the reform process of apple A10X, qualcomm Xiao dragon 835, mediatek Helio X30 mobile chips such as supply is tight, this problem is likely to last throughout the year.
16 nm TSMC technology research and development has multiple versions, including FinFET, FinFET Plus, if present 12 nm process, not only can be in the market, relieve the strain on the supply of 10 nm technology brings problems, but also on the marketing against samsung, GlobalFoundries, smic rivals such as 14 nm process, avoid the loss of orders.
Still uncertain process will start when the application of the process, but now the important question is: before TSMC 10 nm process yield further room for improvement, TSMC cooperation customers products include apple A10X, A11, Helio X30, kirin 970 etc. There are some problems of shortage of supply and demand.
In the recent financial meeting, some analysts help desk top semiconductor, really developed 12 nm, TSMC high-level responded did something similar in research now, but there is no clear mentioned 12 nm, may not be sure whether named 12 nm.
12 nm process relative to today's 16 nm, not only have higher transistor integration, and further optimized in terms of performance and power consumption, have bigger rise.Memory chipsProcess often determines the power consumption, performance, and other factors, such as fever, but now the most advanced technology to achieve production level has reached the level of 10 nm, previously released Xiao dragon 835, adopted the samsung 10 nm process technology, and this year the upcoming release of the new iPhone will use 10 nm TSMC process.
Now there are a lot of information now show that TSMC and samsung, are encountered in 10 nm process technology yield problem, which is also directly contributing to the reform process of apple A10X, qualcomm Xiao dragon 835, mediatek Helio X30 mobile chips such as supply is tight, this problem is likely to last throughout the year.
16 nm TSMC technology research and development has multiple versions, including FinFET, FinFET Plus, if present 12 nm process, not only can be in the market, relieve the strain on the supply of 10 nm technology brings problems, but also on the marketing against samsung, GlobalFoundries, smic rivals such as 14 nm process, avoid the loss of orders.
Still uncertain process will start when the application of the process, but now the important question is: before TSMC 10 nm process yield further room for improvement, TSMC cooperation customers products include apple A10X, A11, Helio X30, kirin 970 etc. There are some problems of shortage of supply and demand.
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