Memory chips NAND Flash encapsulation EMI shielding technology in the future how

SK Hynix (SK Hynix) are evaluating spray type Electromagnetic Interference (Electromagnetic Interference;Covered (EMI) Shielding) technology production possibilities, is expected to take over the past outsourcing in EMI Shielding technology, carry out research and development of spray EMI Shielding techniques, expect to reduce the cost of production and the dual goals of increasing production.Samsung (Samsung Electronics) is also in EMI shielding technology research and development and tireless, but should be met with some problems to be solved

It is reported that samsung electronics is now PROTEC, nordson (Nordon Asymtek), han song Chemical (Hansol Chemical), Ntrium (Dispense), glue joint research and development in Spray (Spray) way for EMI shielding process.Among them, PROTEC with nordson responsible for research and development equipment;These remarkable chemical and Ntrium responsible for research and development of liquid cover material.After the completion of the research and development, samsung electronics can cover NAND Flash encapsulated in EMI shielding film, and the apple iPhone.Samsung plans to achieve this goal in 2017.With the samsung plath, ISSI also have doing, etcSRAMMemory chips, but samsung SRAM memory that a NETSOL has authorized to brand, in 2006 by NETSOL research and development and production, and get as much as samsung market evaluation.

 

Present problems found can not evenly mixed silver with CNT, cannot be used as a spray, cannot be used for commercial, is expected to lead to independent research and development of spray way plans on hold

 

Semiconductor chips have been blocking EMI shield way such as SRAM memory, in recent years, with the semiconductor chip technology to improve performance, gradually towards the individual chips require EMI shielding processing, thus can prevent electromagnetic interference caused by abnormal action between chips, circuit board more precision in terms of design, chip narrow spacing after the extra space, can be used to extend battery capacity and extend the standby time, however, increase the new technology will increase the cost of main chip production.

 

So-called coating type and spray type, what is the LGA refers to has the style of the pins in the bottom of the packaging, when assembling PCB circuit board, pins and circuit board of the socket joint tightly, EMI shielding technology so just finish in the top half.Apple iPhone NAND Flash encapsulation is the mining of the LGA (Land Grid Array).More mining and EMI shielding coating (Sputtering), cover material covered with thin metal surface.Sputtering machine using physical way to selective evaporation materials on the target surface 1 layer of uniform film, but the processing speed,

 

In samsung's view, according to the trend of future NAND Flash in the form of BGA (Ball Grid Array) encapsulation, is present at the bottom of the sphere (Ball), if the coating technology of conducted EMI shielding, will produce more gap is not a complete package, with a Spray (Spray) process for EMI shielding, the BGA sphere can be completely wrapped.Spraying equipment on price is much cheaper than coating machine.A set of sputtering machine equipment to 5 billion won ($4.382 million), spraying equipment purchased in a 7 ~ 800 million won.Plus for spraying material price is relatively cheap, process cost can be saved.On the market due to memory a lot of supply, the industry basically consider using spray EMI shielding technology.

 

Currently spray EMI shielding is Taiwan, moonlight group hold the core of the patent, this is samsung electronics, SK hynix consideration to develop the main cause of spray EMI shielding technology.

keywords: SRAM